Shielding laminates, unlike metal, are non-conductive at their core. While metals like copper are conductive by nature, shielding laminates formed with non-metals excel as insulating or signal shielding materials, which do not respond to electric fields and resist the flow of electric charge.

IP stands for Ion Plating and is a more detailed categorization within PVD technology. PVD methods include vacuum deposition, sputtering, and ion plating (IP). IP is considered the best technique for adhesion and durability.

In the vacuum, materials for coating are evaporated or sputtered, and they deposit onto the substrate, forming a thin film. The absence of air molecules interference allows the coating material to travel straight and create a highly uniform layer.

EMI solutions include three main approaches: electromagnetic interference shielding, printed circuit board grounding, and electromagnetic interference absorption.

• Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
• Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
• Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.