Vacuum metallization encompasses methods like vacuum deposition, sputtering, and ion plating, which create various metal and non-metal films on product surfaces within a vacuum environment, achieving the effect of plating.

In the vacuum, materials for coating are evaporated or sputtered, and they deposit onto the substrate, forming a thin film. The absence of air molecules interference allows the coating material to travel straight and create a highly uniform layer.

Copper/PET shielding tapes is primarily used in various fields, such as extremely fine coaxial wires, low-loss antennas (computers), solar cell wires, etc.

EMI solutions include three main approaches: electromagnetic interference shielding, printed circuit board grounding, and electromagnetic interference absorption.

• Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
• Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
• Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.