Shielding laminates are composed of at least two materials, and the combined performance of these materials exceeds that of their individual components. In our context, we refer to shielding laminates consisting of both metals and non-metals, typically involving the combination of PET, PP, PI, PPS, PTFE with metals like copper and aluminum.

Metal shielding laminates are produced by continuously bonding two thin metal sheets or natural metal films to one side of a thermoplastic core material. These core materials form sheets that are lighter in weight, easy to manufacture, flat, and durable.

Copper/PET shielding tapes is primarily used in various fields, such as extremely fine coaxial wires, low-loss antennas (computers), solar cell wires, etc.

EMI solutions include three main approaches: electromagnetic interference shielding, printed circuit board grounding, and electromagnetic interference absorption.

• Electromagnetic Interference Shielding involves blocking electromagnetic noise and attenuating cable-collected noise. It uses high-reflectance materials (usually low-resistance metals) to encase or seal openings in target devices for EMI and EMS solutions.
• Printed Circuit Board (PCB) Grounding refers to grounding electronic equipment electrically to prevent electric shock, treating the Earth as a massive conductor at zero electric potential. Two grounding methods are employed: frame grounding and signal grounding on PCBs.
• Electromagnetic Interference Absorption (EMI Absorption) utilizes magnetic loss, dielectric loss, and conduction loss to convert radio wave energy into thermal energy. EMI absorbers have a wide range of applications.