Shielding laminates, unlike metal, are non-conductive at their core. While metals like copper are conductive by nature, shielding laminates formed with non-metals excel as insulating or signal shielding materials, which do not respond to electric fields and resist the flow of electric charge.

Shielding laminates are composed of at least two materials, and the combined performance of these materials exceeds that of their individual components. In our context, we refer to shielding laminates consisting of both metals and non-metals, typically involving the combination of PET, PP, PI, PPS, PTFE with metals like copper and aluminum.

RA copper foil and ED copper foil have their respective advantages and disadvantages.

• RA copper foil is purer in terms of copper content.
• RA copper foil offers better overall physical performance compared to electrolytic copper foil.
• Both types of copper foil have nearly identical chemical properties.
• In terms of cost, ED copper foil is usually less expensive due to its simpler manufacturing process and the ease of mass production.
• Typically, RA copper foil is used in the early stages of product manufacturing, but as manufacturing processes mature, ED copper foil is often utilized to reduce costs.

Copper ions are highly reactive in the presence of air and can easily react with oxygen ions to form copper oxide. While we treat the surface of copper foil with room temperature anti-oxidation processes during production, this treatment only delays the oxidation of copper foil. Therefore, it is recommended to use copper foil as soon as possible after opening. Unused copper foil should be stored in a dry, light-resistant area and away from volatile gases. The recommended storage temperature for copper foil is approximately 25 degrees Celsius, with humidity not exceeding 70%.